The highlyaccelerated temperature and humidity stress test is performed for the purpose of evaluating the reliability of nonhermetic packaged solidstate devices in humid environments. This document is available in either paper or pdf format. Multiplier unsigned generator 11 2440a1201 atmel headquarters atmel. Pdf drop impact dynamic response study of jedec jesd22. The stsafea110 is a highly secure solution that acts as a secure element providing. The purpose of this test method is to evaluate the reliability of. Jep140 datasheet, cross reference, circuit and application notes in pdf format. Recent listings manufacturer directory get instant. Drop impact dynamic response study of jedec jesd22 b111 test board. Jedec jesd22 a108 pdf and is released for production with a jedec jstd msl 1 moisture sensitivity level jesda temperature, bias, and operating life. Jesd22 a104 datasheet, cross reference, circuit and application notes in pdf format. Hast jesd22 a110 c, 85% rh, biased 96 hr 3 x 025 high temperature storage test htsl jesd22 a103 150c hr 3 x 025 high temperature operating life.
Jedec publication 21 manual of organization and procedure. The cycled temperaturehumidity biased life test is performed for the purpose of evaluating the reliability of nonhermetic, packaged solid state devices. Highly accelerated temperature and humidity standards. Jesd22 b103 20g, 202khz 4 mincycle, 4 cyclesaxis, 3 axis 22 0 table 3. The test is applicable for evaluation, screening, monitoring, andor qualification of all solid state devices. The circuit includes a dcdc converter that supplies the internal logic and memories with a. Product qualification report 1edn7512g infineon technologies.
For manual soldering contact time must be limited to 5. This standard establishes a defined method and conditions for performing a temperaturehumidity life test with bias applied. The test is used to evaluate the reliability of nonhermetic. The jesd22a110 highlyaccelerated temperature and humidity stress test is performed for the purpose of evaluating the reliability of nonhermetic packaged solidstate devices in humid environments. This document comes with our free notification service, good for the life of the document. Jedec standard 22a103c page 4 test method a103c revision of a103b annex a informative difference between jesd22 a103c and jesd22 a103b this table briefly describes most of the changes made to entries that appear in this standard, jesd22 a103c, compared to its predecessor, jesd22 a103b august 2001. The highlyaccelerated temperature and humidity stress test is performed for the purpose of evaluating the reliability of nonhermetic. It is a highly accelerated test which employs temperature and humidity under noncondensing conditions to accelerate the penetration of moisture through the external. Jedec standards for product level qualification global standards for the microelectronics industry christian gautier. The high temperature storage test is typically used to determine the effects of time and temperature, under storage conditions, for thermally activated failure mechanisms and timetofailure distributions of solid state electronic devices, including nonvolatile memory devices data. The unbiased hast is performed for the purpose of evaluating the reliability of nonhermetic packaged solidstate devices in humid environments.